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SK海力士公布最新HBM进展 称竞争焦点从内存性能转向封装技术_我的网站

一 |     Jakarta, Oct 20 (UNI) The deaths of nearly 100 children in Indonesia has prompted the country to suspend sales of all syrup and liquid medication.
It comes just weeks after a cough syrup in The Gambia was linked to the deaths of nearly 70 children, reports BBC.
Indonesia said some syrup medicine was found to contain ingredients linked to acute kidney injuries (AKI), which have killed 99 young children this year.
It was not clear if the medicine were imported or locally produced.
On Thursday, Indonesian health officials said they had reported around 200 cases of AKI in children, most of who were aged under five, the BBC reported.
Earlier this month, the The World Health Organization (WHO) issued a global alert over four cough syrups that were linked to the deaths of almost 70 children in The Gambia.
The WHO found the syrups used there -- made by an Indian pharmaceutical company -- contained "unacceptable amounts" of diethylene glycol and ethylene glycol. The syrups have been "potentially linked with acute kidney injuries", said the organisation.
Indonesia's Health Minister on Thursday said the same chemical compounds were also found in some medicines used locally.
"Some syrups that were used by AKI child patients under five were proven to contain ethylene glycol and diethylene glycol that were not supposed to be there, or of very little amount," said Budi Gunadi Sadikin. He did not disclose how many cases involved the toxic medicines.
Indonesian authorities said the cough syrups used in The Gambia were not sold locally.
Indonesian authorities have so far not disclosed the brands or types of syrup medicines linked to sick children - instead just temporarily banning the sale and prescription of all syrup and liquid medicines.
UNI MR。    

财联社8月24日讯（编辑 马兰）人工智能数据中心使用的高带宽内存（HBM）技术正在出现重大转向。SK海力士美国公司副总裁Lee Jae-sik最新表示，未来行业不仅需要关注HBM本身，还需要关注封装技术如何影响HBM。Lee在当地时间23日出席了美国斯坦福大学举行的半导体会议Hot Chips 2026，并发表了题为“HBM的高科技封装”演讲。他表示，在人工智能半导体时代，为了确保竞争力，不仅HBM本身的性能需要优化，GPU、封装和代工工艺也必须进行优化。

二 | 目前，SK海力士的HBM采用三维堆叠式设计，通过硅通孔将多个核心芯片连接到一个基底芯片上。HBM目前最高可达16层堆叠。

三 | 封装技术则采用了MR+MUF（回流焊+注塑底部填充）。

四 | 相比于TC+NCF（热压+非导电薄膜），MR+MUF生产效率更高，热阻更低，但更容易发生芯片翘曲，并且存在间隙填充方面的不足。

五 | 但SK海力士结合了翘曲控制和精细间距集成及窄间隙填充新技术，成功提高了现有HBM的性能。

六 | SK海力士还在开发混合键合封装技术，以实现超越16层堆叠的20层或更多层的目标。该技术可在相同高度下将核心芯片厚度增加高达24%，并通过消除现有微凸点并直接连接芯片，将凸点间距缩小至18微米以下。

七 | 此外，该技术有望通过更高效的散热来减少发热问题。

携手优化的时代与现有存储器不同，HBM在人工智能半导体中首先被组装到中介层上。

八 | Lee指出，过去存储器是在系统组装的最后阶段安装的，但在人工智能时代截然不同，这要求HBM的可靠性更加重要。

九 | 他补充称，HBM必须承受后续工艺中产生的热量和机械应力，因此与客户进行联合开发至关重要。这也意味着，内存厂商、GPU设计商、代工厂和封装厂商必须从一开始就进行协同设计。SK海力士还在会上发布了一项用于冷却HBM内部特定区域“热点”的技术。

十 | Lee表示，HBM的输入/输出速度越快，热量就越集中在某些区域。正在开发的iHBM技术通过添加耐高温导热材料，只对热量集中的区域进行集中冷却，而非对整个HBM进行冷却。他还指出，HBM的带宽和容量未来将继续增长，但发热、功耗和封装将成为更大的挑战，这要求客户、代工厂和封装公司必须携手优化。

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Published on:18:05:05